wafer thinning

См. также в других словарях:

• Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a …   Wikipedia

• Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… …   Wikipedia

• Photolithography — For earlier uses of photolithography in printing, see Lithography. For the same process applied to metal, see Photochemical machining. Photolithography (or optical lithography ) is a process used in microfabrication to selectively remove parts of …   Wikipedia

• materials science — the study of the characteristics and uses of various materials, as glass, plastics, and metals. [1960 65] * * * Study of the properties of solid materials and how those properties are determined by the material s composition and structure, both… …   Universalium

• thin — thin1 W2S2 [θın] adj comparative thinner superlative thinnest ▬▬▬▬▬▬▬ 1¦(not thick)¦ 2¦(not fat)¦ 3¦(hair)¦ 4¦(liquid)¦ 5¦(smoke/mist)¦ 6¦(air)¦ 7¦(excuse/argument/evidence etc)¦ 8 a thin …   Dictionary of contemporary English

• Nerve guidance conduit — A nerve guidance conduit (also referred to as an artificial nerve conduit or artificial nerve graft, as opposed to an autograft) is an artificial means of guiding axonal regrowth to facilitate nerve regeneration and is one of several clinical… …   Wikipedia

• Spin coating — is a procedure used to apply uniform thin films to flat substrates. In short, an excess amount of a solution is placed on the substrate, which is then rotated at high speed in order to spread the fluid by centrifugal force. A machine used for… …   Wikipedia